Mandelli regent sistema 1000
Mandelli regent sistema 1000
Mazak VTE 20C
Mazak VTE 20C, 1997. MAZAK VC-300A/5X Vertical Machining Centers (5-Axis or More) Mazak VC-300A/5X, Installed New in 2022, Mfg. Date 2019, Mazatrol Smooth X Control, 12,000 RPM Spindle, High-Pressure Through-Spindle Coolant,
valmistaja tesera plate cutter
valmistaja tesera plate cutter
Tailift HPS1250
Item Unit HPS1250 Punching Capacity Ton 20 X Traverse Length mm 1250±10 Y Traverse Length mm 1250±10 Max Sheet Size mm 1250×2500 Max Sheet Thickness mm 6.35 Max Sheet Weight kg 110 X Axis Traverse Speed m/min 75 Y Axis Traverse Speed m/min 60 Max Traverse Speed m/min 96 Punch Speed at hist/min 360 25mm …
DUTRANNOIT
Make : DUTRANNOIT Folding lenght : 3000 mm Gooseneck:200 mm V-shaped motor block : 4V^d ÇA: 75 Metric To Electric depth adjustment Motor :5kw 220/380 V Friction clutch Weight :± 3500 Kg
OKUMA LB 300 MY C OKUMA LB 15 II MW OKUMA LC 10 2ST
1st CNC controlled multi-operation turning OKUMA LB 300 MY-C. Powered tools, Y-axis machining and rod loading magazine. Dia. 52 mm rod capacity. Chuck max 200 mm, stud. Tillv.år1999. Production time according to control system about 11500 hours. 2nd CNC controlled multi-operation yard OKUMA LB 15 II MW. Sub-spindle, driven tools, measuring control and cutting force …
OKUMA LB 300 MY C OKUMA LB 15 II MW OKUMA LC 10 2ST Weiterlesen »
Okuma lathe
Okuma lathe
Resist Removal and Wafer Cleaning Machine,produced by Solid State Equipment Corp SSEC 3300
Resist Removal and Wafer Cleaning Machine,produced by Solid State Equipment Corp SSEC 3300
Single Diamond Polishing Machine Nano Surface SL910-SFCL
Not in use. The equipment is in good working condition
Double side lapping machine ADL-1000
very good! Not in use. Located in the warehouse. Machines are in excellent technical condition. As a package for sale we can include carriers/separators for wafers processing of different diameters. These machines can process 2-8” wafers